| PCB Manufacture Capabilities | |||
|
No
|
Items | Capabilities(for Sample) | Capabilities(for Mass Production) |
|
1
|
Layer count | 1-20L | 1-16 Layer |
|
2
|
Board Thickness | 0.2-7.0mm | 0.4-6.0mm |
|
3
|
Maximum Board Size | 610*1100mm | 550*650mm |
|
4
|
Copper Thickness | Inner Layer: H-6OZ | Inner Layer: H-4OZ |
| Outer Layer: H-7OZ | Outer Layer: H-5OZ | ||
|
5
|
Minimum Finished Hole Size | 0.15mm | 0.2mm |
|
6
|
Hole Diameter Tolerance | PTH: ±0.05mm | PTH: ±0.075mm |
| NPTH: ±0.05mm | NTTH: ±0.05mm | ||
|
7
|
Maximum Aspect Ratio | 16:1 | 10:1 |
|
8
|
Minimum Line Width | 3.0mil | 3.0mil |
|
9
|
Minimum Line Spacing | 3.0mil | 3.0mil |
|
10
|
Outline Size Tolerance | ±0.10mm | ±0.15mm |
|
11
|
Minimum Bow and Twist | 0.50% | 0.75% |
|
12
|
Soldermask Color |
Green,Yellow,Black,Blue, Red,White,Purple |
Green,Yellow,Black,Blue, Red,White,Purple |
|
13
|
Minimum Solder Mask Dam |
4mil(Green), 5mil(Other color) |
4mil(Green), 5mil(Other color) |
|
14
|
Silkscreen Color | White,Yellow,Black | White,Yellow,Black |
|
15
|
HASL Tin Thickness | 2-40um | 2-40um |
|
16
|
Flash Gold(electroplated gold) | Ni:≥3um;Au:0.025-0.1um | Ni:≥3um;Au:0.025-0.1um |
|
17
|
ENIG | Ni:3-8um;Au:0.05-0.1um | Ni:3-8um;Au:0.05-0.1um |
|
18
|
Immersion Tin | ≥1.0um | ≥1.0um |
|
19
|
Immersion Silver | 0.2-0.4um | 0.2-0.4um |
|
20
|
OSP | 0.1-0.3um | 0.1-0.3um |
|
21
|
Hard Gold | 0.1-4.0um | 0.1-4.0um |
|
22
|
ENEPIG |
Ni:3-8um; Pd:0.05-0.15um; Au:0.05-0.1um |
Ni:3-8um; Pd:0.05-0.15um; Au:0.05-0.1um |
|
23
|
Carbon | 0.10-0.35um | 0.10-0.35um |
|
24
|
Peelable Solder mask | 0.20-0.50mm | 0.20-0.50mm |
|
25
|
Raw Material |
FR-4,High Tg FR-4, Halogen-Free,PTFE,Aluminum base material,Ceramic Partide Filled Laminates |
FR-4,High Tg FR-4,Halogen-Free,PTFE,Aluminum base material,Ceramic Partide Filled Laminates |
|
26
|
Surface Treatment |
Sn/Pb HASL, Leadfree HASL, FlashGold, ENIG,Immersion Tin, Immersion Silver, OSP(Entek),Hard Gold, Soft Gold,ENIG+OSP, ENIG+Gold finger, Hard Gold+Gold finger, Immersion Silver+Gold finger, Immersion Tin+Gold finger,ENEPIG |
Sn/Pb HASL, Leadfree HASL, FlashGold,ENIG, Immersion Tin, ImmersionSilver, OSP(Entek), Hard Gold,Soft Gold, ENIG+OSP, ENIG+Gold finger, Hard Gold+Gold finger, Immersion Silver+Gold finger,Immersion Tin+Gold finger,ENEPIG |
